For R&D Design SMD, ISA bus Prototype Card
CV-15 SMD PROTOTYPE CARD
Introduction:
1. Size:34cm x 9.9cm.
2. Support both ISA(98P) and EISA(188P) Bus structure; EISA slot pads x1.
3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-50P x 2.
4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-26P x 2.
*** magic SMD pads: Suitable for chips with different number of pins ***
5. Plastic Leaded Chip Carrier(PLCC) pads: NO. 1-6 pitch 1.27mm, 20-84P
6. Rectangle Flat Pack(R.F.P.) pads:
No. 7 pitch 1.0mm 14-92P L-W=6P
No. 8 pitch 0.8mm 18-112P L-W=8P
No. 9 pitch 0.65mm 22-140P L-W=10P
7. Quadrangle Flat Pack(Q.F.P.) pads:
No. 10 pitch 1.0mm.4-104P
No. 11 pitch 0.8mm.4-128P
No. 12 pitch 0.65mm.4-160P
8. Other Pitch 2.54 x 2.54mm grid through-holes 2099pcs.
CV15I-8B ISA-8bit PROTOTYPE CARD
Introduction:
1. Size:15.9cm x 11.2cm.
2. Support ISA BUS-8bit structure(62 pins golden finger); ISA-8bit slot pads x 1.
3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-9Px1 and 0-62P x 1.
4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-38P x 1.
5. High Density D-SUB connector pads: Pitch 2.41 x 1.98mm 0-62P x 1.
6. Centronic connector Pads: Pitch 4.29 x 2.16mm 0-36P x 1.
7. Pitch 3.96x3.96mm pads 0-24P x 1
8. Other Pitch 2.54 x 2.54mm grid through-holes 2028pcs.
CV-15I ISA-16bit PROTOTYPE CARD
Introduction:
1. Size:33.2cm x 11.2cm.
2. Support ISA BUS-16bit structure(98 pins golden finger); ISA-16bit slot pads x 1.
3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-9P x 1 and 0-62P x 1.
4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-38P x 1.
5. High Density D-SUB connector pads: Pitch 2.41 x 1.98mm 0-62P x 1.
6. Centronic connector Pads: Pitch 4.29 x 2.16mm 0-36P x 1.
7. Pitch 3.96 x 3.96mm pads 0-24P x 1
8. Pitch 5.08 x 2.54mm "X-grid" pads 0-50P x 1.
9. Pitch 2.54 x 1.27mm "X-grid" through-holes 114pcs.
10. Other Pitch 2.54 x 2.54mm grid through-holes 4683pcs.
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Start: 20/04/1998 Update:04.01.2011
