For R&D Design SMD ISA bus Prototype Card

CV15-I-I8

CV-15 SMD PROTOTYPE CARD

Introduction:

1. Size:34cm x 9.9cm.

2. Support both ISA(98P) and EISA(188P) Bus structure; EISA slot pads x1.

3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-50P x 2.

4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-26P x 2.

*** magic SMD pads: Suitable for chips with different number of pins ***

5. Plastic Leaded Chip Carrier(PLCC) pads: NO. 1-6 pitch 1.27mm, 20-84P

6. Rectangle Flat Pack(R.F.P.) pads:

No. 7 pitch 1.0mm 14-92P L-W=6P

No. 8 pitch 0.8mm 18-112P L-W=8P

No. 9 pitch 0.65mm 22-140P L-W=10P

7. Quadrangle Flat Pack(Q.F.P.) pads:

No. 10 pitch 1.0mm.4-104P

No. 11 pitch 0.8mm.4-128P

No. 12 pitch 0.65mm.4-160P

8. Other Pitch 2.54 x 2.54mm grid through-holes 2099pcs.

CV15I-8B ISA-8bit PROTOTYPE CARD

Introduction:

1. Size:15.9cm x 11.2cm.

2. Support ISA BUS-8bit structure(62 pins golden finger); ISA-8bit slot pads x 1.

3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-9Px1 and 0-62P x 1.

4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-38P x 1.

5. High Density D-SUB connector pads: Pitch 2.41 x 1.98mm 0-62P x 1.

6. Centronic connector Pads: Pitch 4.29 x 2.16mm 0-36P x 1.

7. Pitch 3.96x3.96mm pads 0-24P x 1

8. Other Pitch 2.54 x 2.54mm grid through-holes 2028pcs.

CV-15I ISA-16bit PROTOTYPE CARD

Introduction:

1. Size:33.2cm x 11.2cm.

2. Support ISA BUS-16bit structure(98 pins golden finger); ISA-16bit slot pads x 1.

3. Regular D-SUB connector pads: Pitch 2.77 x 2.84mm 0-9P x 1 and 0-62P x 1.

4. High Density D-SUB connector pads: Pitch 2.29 x 2.54mm 0-38P x 1.

5. High Density D-SUB connector pads: Pitch 2.41 x 1.98mm 0-62P x 1.

6. Centronic connector Pads: Pitch 4.29 x 2.16mm 0-36P x 1.

7. Pitch 3.96 x 3.96mm pads 0-24P x 1

8. Pitch 5.08 x 2.54mm "X-grid" pads 0-50P x 1.

9. Pitch 2.54 x 1.27mm "X-grid" through-holes 114pcs.

10. Other Pitch 2.54 x 2.54mm grid through-holes 4683pcs.


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Start: 20/04/1998 Update: 07.06.2012