Prototype/Prototyping card萬用板
CV-15V VL-bus萬用板
1. Size: 33.2cm x 11.2cm.
2. Support VL/ISA Bus structure(98/112P pins golden finger); VL/ISA-slot pads x1.
3. Regular D-SUB connector pads: Pitch 2.77x2.84mm 0-9P and 0-62P.
4. High Density D-SUB connector pads: Pitch 2.29x2.54mm 0-38P.
5. High Density D-SUB connector pads: Pitch 2.41x1.98mm 0-62P.
6. Centronic connector pads: Pitch 4.29x2.16mm 0-36P.
7. Pitch 3.96x3.96mm pads: 0-24P.
8. Pitch 5.08x2.54mm "X" grid pads: 0-50P.
9. Pitch 2.54x1.27mm "X" grid through-holes 152pcs.
10. Other 2.54x2.54mm grid through-holes 4339pcs.
CV-15E EISA-bus萬用板
1. Size: 33.2cm x10.9cm.
2. Support EISA Bus structure(188 pins golden finger); EISA-slot pads x1.
3. Regular D-SUB connector pads: Pitch 2.77x2.84mm 0-9P and 0-62P.
4. High Density D-SUB connector pads: Pitch 2.29x2.54mm 0-38P.
5. High Density D-SUB connector pads: Pitch 2.41x1.98mm 0-62P.
6. Centronic connector pads: Pitch 4.29x2.16mm 0-36P.
7. Pitch 3.96x3.96mm pads: 0-24P.
8. Pitch 5.08x2.54mm "X" grid pads: 0-50P.
9. Pitch 2.54x1.27mm "X" grid through-holes 152pcs.
10. Other 2.54x2.54mm grid through-holes 4378pcs.
CV-15P PCI-bus萬用板
1. Size: 33.2cm x 11.2cm.
2. Support PCI Bus structure(120P pins golden finger); PCI-slot pads x1.
3. Regular D-SUB connector pads: Pitch 2.77x2.84mm 0-9P and 0-62P.
4. High Density D-SUB connector pads: Pitch 2.29x2.54mm 0-38P.
5. High Density D-SUB connector pads: Pitch 2.41x1.98mm 0-62P.
6. Centronic connector pads: Pitch 4.29x2.16mm 0-36P.
7. Pitch 3.96x3.96mm pads: 0-24P.
8. Pitch 5.08x2.54mm "X" grid pads: 0-50P.
9. Pitch 2.54x1.27mm "X" grid through-holes 152pcs.
10. Other 2.54x2.54mm grid through-holes 4510pcs.
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Start: 中華民國八十六年七月一日 Update:2011年03月24日